RD53 pixel chips for the ATLAS and CMS Phase-2 upgrades at HL-LHC

Loddo, F.; Andreazza, A.; Arteche, F.; Barbero, M. B.; Barillon, P.; Beccherle, R.; Bilei, G. M.; Bjalas, W.; Bonaldo, S.; Bortoletto, D.; Calderini, G.; Caratelli, A.; Christian, D. C.; Christiansen, J.; Conti, E.; Crescioli, F.; Daas, M.; De Robertis, G.; Demaria, N.; Deptuch, G. C.; Dieter, Y.; Dimitrievska, A.; Ding, L.; Esposito, S.; Exarchou, D.; Fahim, F.; Fioriti, A.; Fougeron, D.; Gaioni, L.; Garcia-Sciveres, M.; Gerardin, S.; Gnani, D.; Grippo, M.; Gromov, V.; Hamer, M.; Havranek, M.; Heim, T.; Hemperek, T.; Hinterkeuser, F.; Hoff, J.; Huiberts, S.; Janssen, J.; Jara Casas, L. M.; Jirsa, J.; John, J. J.; Kampkotter, J.; Karagounis, M.; Khwaira, Y.; Kluit, R.; Krieger, A.; Krueger, H.; Lalic, J.; Lauritzen, M.; Licciulli, F.; Lipton, R.; Liu, T.; Lopez Morillo, E.; Lounis, A.; Luongo, F.; Magazzu, G.; Marcisovsky, M.; Marconi, S.; Marquez Lasso, F.; Marzocca, C.; Mattiazzo, S.; Menouni, M.; Minuti, M.; Mironova, M.; Miryala, S.; Monteil, E.; Moustakas, K.; Muõz Chavero, F.; Neue, G.; Orfanelli, S.; Paccagnella, A.; Pacher, L.; Palla, F.; Palomo Pinto, F. R.; Papadopoulou, A.; Paterno, A.; Petri, A.; Placidi, P.; Pohl, D.; Pradas, A.; Prydderch, M. L.; Pulli, A.; Ratti, L.; Re, V.; Rehman, A.; Rymaszewski, P.; Solal, M. C.; Standke, M.; Stiller, A.; Strebler, T.; Stugu, B.; Thomas, S.; Traversi, G.; Vogrig, D.; Vogt, M.; Wang, T.; Yang, H.; Zdenko, J.; Zimmerman, T.

doi:10.1016/j.nima.2024.169682

rate (3.5 GHz/cm2) and high data rate readout (5 Gb/s). The RD53 collaboration is a joint effort between the ATLAS and CMS to qualify the chosen 65 nm CMOS technology in high radiation environment and develop the pixel readout chips of both experiments. After a half-scale demonstrator (RD53A) and full scale prototypes of the two ASICs (RD53B-ATLAS and RD53B-CMS), largely used by the two communities to characterize 3D and planar sensors, RD53 developed and submitted to foundry in 2023 the production chips. A general overview of the chip architecture will be described.