This paper describes an extensive analysis of the degradation of InGaN-based LEDs submitted to reverse-bias stress and Electrostatic Discharge events. Results described within the paper indicate that: (i) reverse-bias current flows through localized leakage paths, related to the presence of structural defects; (ii) the position of these paths can be identified by means of emission microscopy; (iii) reverse-bias stress can induce a degradation of the electrical characteristics of the devices (decrease in breakdown voltage); (iv) degradation is due to the injection of highly accelerated carriers through the active region of the LEDs, with the subsequent generation/propagation of point defects; (v) the localized leakage paths responsible for reverse-current conduction can constitute weak regions with respect to reverse-bias ESD events.

A study of Failure of GaN-based LEDs submitted to reverse-bias stress and ESD events

MENEGHINI, MATTEO;TAZZOLI, AUGUSTO;MENEGHESSO, GAUDENZIO;ZANONI, ENRICO;
2010

Abstract

This paper describes an extensive analysis of the degradation of InGaN-based LEDs submitted to reverse-bias stress and Electrostatic Discharge events. Results described within the paper indicate that: (i) reverse-bias current flows through localized leakage paths, related to the presence of structural defects; (ii) the position of these paths can be identified by means of emission microscopy; (iii) reverse-bias stress can induce a degradation of the electrical characteristics of the devices (decrease in breakdown voltage); (iv) degradation is due to the injection of highly accelerated carriers through the active region of the LEDs, with the subsequent generation/propagation of point defects; (v) the localized leakage paths responsible for reverse-current conduction can constitute weak regions with respect to reverse-bias ESD events.
2010
IRPS2010, International Reliability Physics Symposium
IRPS2010, International Reliability Physics Symposium
9781424454310
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11577/2466379
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