The physical mechanisms underlying RF current collapse effects in AlGaN-GaN HEMTs are investigated by means of measurements and numerical device simulations. Our study suggests that 1) both surface and buffer traps can contribute to RF current collapse through a similar physical mechanism involving capture/emission of electrons tunneling from the gate; 2) surface passivation strongly mitigate RF current collapse, by reducing the surface electric field and inhibiting electron injection into traps; 3) for surface donor trap densities lower than 9×1012 cm-2, surface potential barriers in the 1-2 eV range can coexist with surface traps having much a shallower energy depth and inducing, therefore, current-collapse effects characterized by relatively short time constants.

Effects Of Surface And Buffer Traps In Passivated Algan-GaN HEMTs

DANESIN, FRANCESCA;RAMPAZZO, FABIANA;MENEGHESSO, GAUDENZIO;ZANONI, ENRICO;
2008

Abstract

The physical mechanisms underlying RF current collapse effects in AlGaN-GaN HEMTs are investigated by means of measurements and numerical device simulations. Our study suggests that 1) both surface and buffer traps can contribute to RF current collapse through a similar physical mechanism involving capture/emission of electrons tunneling from the gate; 2) surface passivation strongly mitigate RF current collapse, by reducing the surface electric field and inhibiting electron injection into traps; 3) for surface donor trap densities lower than 9×1012 cm-2, surface potential barriers in the 1-2 eV range can coexist with surface traps having much a shallower energy depth and inducing, therefore, current-collapse effects characterized by relatively short time constants.
2008
32 Workshop on Compound Semiconductor Devices and Integrated Circuits, WOCSDICE 2008
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11577/2273251
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