Editorial

This special issue of Microelectronics Reliability contains the papers presented at the 23rd European Symposium on the Reliability of Electron Devices, Failure Physics and Analysis, (ESREF 2012) which was held in Cagliari (Sardinia), Italy, from October 1 to 5, 2012. Since 1990, ESREF traditionally focuses on the latest research findings in Quality and Reliability of materials, devices, and circuits for microelectronics. It provides the annual European forum, where researchers coming from all over the world present the results of their researches related to the various aspects of the reliability management and define the state of the art in advanced analysis techniques for present and future semiconductor applications, with a particular attention to specification, technology and manufacturing, test, control and analysis.