To address the inherent strength-ductility trade-off in FeCoCrNiCu high-entropy alloy (HEA)-reinforced copper matrix composites, bulk composites were fabricated by three-dimensional vibratory mixing followed by spark plasma sintering (SPS) at 750 °C, 850 °C, and 950 °C. The influence of sintering temperature on microstructural evolution and the resulting strength and ductility was systematically investigated, supported by complementary atomic-scale molecular dynamics (MD) simulations. Microstructural characterization and mechanical testing revealed that sintering temperature effectively modulates the densification level, interfacial metallurgical bonding quality, and key microstructural features of the composites. The contributions from load transfer strengthening, dislocation strengthening, and grain boundary strengthening were quantitatively evaluated, uncovering a systematic evolution in the relative dominance of each strengthening mechanism with increasing sintering temperature. At the optimal sintering condition of 950 °C, the composite exhibited the highest relative density and interfacial bonding strength, with a yield strength of 157.17 MPa, ultimate tensile strength of 306.37 MPa, and elongation to fracture of 21.15%. MD simulations further elucidated the temperature-dependent behaviors of interfacial atomic interdiffusion, interfacial structural evolution, and dislocation multiplication/entanglement under tensile loading. This work provides a multi-scale theoretical and experimental basis for the microstructural design and process optimization of copper matrix composites with simultaneously improved strength and ductility.
Synergistic improvement of strength and toughness in FeCoCrNiCu high-entropy alloy/copper composites
Liu K.;
2026
Abstract
To address the inherent strength-ductility trade-off in FeCoCrNiCu high-entropy alloy (HEA)-reinforced copper matrix composites, bulk composites were fabricated by three-dimensional vibratory mixing followed by spark plasma sintering (SPS) at 750 °C, 850 °C, and 950 °C. The influence of sintering temperature on microstructural evolution and the resulting strength and ductility was systematically investigated, supported by complementary atomic-scale molecular dynamics (MD) simulations. Microstructural characterization and mechanical testing revealed that sintering temperature effectively modulates the densification level, interfacial metallurgical bonding quality, and key microstructural features of the composites. The contributions from load transfer strengthening, dislocation strengthening, and grain boundary strengthening were quantitatively evaluated, uncovering a systematic evolution in the relative dominance of each strengthening mechanism with increasing sintering temperature. At the optimal sintering condition of 950 °C, the composite exhibited the highest relative density and interfacial bonding strength, with a yield strength of 157.17 MPa, ultimate tensile strength of 306.37 MPa, and elongation to fracture of 21.15%. MD simulations further elucidated the temperature-dependent behaviors of interfacial atomic interdiffusion, interfacial structural evolution, and dislocation multiplication/entanglement under tensile loading. This work provides a multi-scale theoretical and experimental basis for the microstructural design and process optimization of copper matrix composites with simultaneously improved strength and ductility.
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