Traditionally produced Superconducting Radio Frequency (SRF) cavities are characterized by many limiting drawbacks, such as welding lines and poor reproducibility of their properties. Additive Manufacturing (AM), and in particular Laser Powder Bed Fusion (LPBF), may overcome these issues: with this technology, it is possible to create seamless components with reproducible characteristics. 6 GHz cavities cannot see internal supports because of the impossibility to remove them mechanically. On the other hand, the down-skin self-supporting surfaces are extremely rough and unsuitable for the intended application. Indeed, very smooth surfaces are required since copper cavities are internally coated with superconducting films (like Nb, Nb3Sn, etc). In this work, several surface treatments have been performed and studied; tests like tightness, resonant frequency and internal inspections have also been carried out.

Additive Manufacturing of 6 GHz seamless SRF copper cavities: printing, surface treatments and performance investigations

V. Candela
;
S. Candela;G. Favero;E. Chyhyrynets;
2023

Abstract

Traditionally produced Superconducting Radio Frequency (SRF) cavities are characterized by many limiting drawbacks, such as welding lines and poor reproducibility of their properties. Additive Manufacturing (AM), and in particular Laser Powder Bed Fusion (LPBF), may overcome these issues: with this technology, it is possible to create seamless components with reproducible characteristics. 6 GHz cavities cannot see internal supports because of the impossibility to remove them mechanically. On the other hand, the down-skin self-supporting surfaces are extremely rough and unsuitable for the intended application. Indeed, very smooth surfaces are required since copper cavities are internally coated with superconducting films (like Nb, Nb3Sn, etc). In this work, several surface treatments have been performed and studied; tests like tightness, resonant frequency and internal inspections have also been carried out.
2023
JaCoW Publishing
14th International Particle Accelerator Conference
978-3-95450-231-8
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11577/3544286
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