In this paper, the electromagnetic wave (EMW) absorption properties of SiCN ceramics with a shellular structure prepared by 3D printing technology (DLP) at different pyrolysis temperatures were investigated. The research shows that polarization loss and multiple reflections are the principal reasons for the improvement in sample absorption performance. The shellular structure is favorable for the multiple reflections and scattering of electromagnetic wave inside the material. The turbostratic carbon, graphitic carbon and SiC generated by pyrolysis are conducive to improving the dielectric loss of the sample, adjusting its impedance matching performance and improving its absorption performance. The RLmin of SiCN-1200 reaches − 21.12 dB (3.22 mm), and the effective band width is 4.20 GHz, covering the whole X-band. The excellent EMW absorption performance of DLP-SiCN ceramics, together with additive manufacturing, enable the integration of material, structure and function within a single component.

Shellular SiCN ceramics with integrated structure and function realizing full electromagnetic wave absorption in the X-band

Colombo P.
2024

Abstract

In this paper, the electromagnetic wave (EMW) absorption properties of SiCN ceramics with a shellular structure prepared by 3D printing technology (DLP) at different pyrolysis temperatures were investigated. The research shows that polarization loss and multiple reflections are the principal reasons for the improvement in sample absorption performance. The shellular structure is favorable for the multiple reflections and scattering of electromagnetic wave inside the material. The turbostratic carbon, graphitic carbon and SiC generated by pyrolysis are conducive to improving the dielectric loss of the sample, adjusting its impedance matching performance and improving its absorption performance. The RLmin of SiCN-1200 reaches − 21.12 dB (3.22 mm), and the effective band width is 4.20 GHz, covering the whole X-band. The excellent EMW absorption performance of DLP-SiCN ceramics, together with additive manufacturing, enable the integration of material, structure and function within a single component.
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11577/3513593
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