PASCUCCI, JACOPO
PASCUCCI, JACOPO
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Hybrid Cu particle paste with surface-modified particles for high temperature electronics packaging
2019 Krishna Bhogaraju, Sri; Mokhtari, Omid; Pascucci, Jacopo; Conti, Fosca; Elger, Gordon
Improved sinterability of particles to substrates by surface modifications on substrate metallization
2019 Krishna Bhogaraju, Sri; Mokhtari, Omid; Pascucci, Jacopo; Conti, Fosca; Elger, Gordon
Titolo | Data di pubblicazione | Autori | Rivista | Serie | Titolo libro |
---|---|---|---|---|---|
Hybrid Cu particle paste with surface-modified particles for high temperature electronics packaging | 2019 | Jacopo PascucciFosca Conti + | - | - | Proceeding of EMPC-2019 |
Improved sinterability of particles to substrates by surface modifications on substrate metallization | 2019 | Jacopo PascucciFosca Conti + | - | - | Proceeding of HiTEN-2019 |