CONTI, FOSCA
CONTI, FOSCA
Dipartimento di Scienze Chimiche - DiSC
Copper die bonding using copper formate based pastes with a-terpineol, amino-2-propanol and hexylamine as binders
2020 Krishna Bhogaraju, Sri; Conti, Fosca; Elger, Gordon
Development of sinter paste with surface modified copper alloy particles for die-attach bonding
2020 Krishna Bhogaraju, Sri; Conti, Fosca; Schmid, Maximilian; R Meier, Markus; Schweigart, Helmut; Elger, Gordon
Finite element simulations and raman measurements to investigate thermomechanical stress in GaN-LEDs
2020 Conti, Fosca; Liu, E; Krishna Bhogaraju, Sri; Wunderle, Bernhard; Elger, Gordon
Genetic engineering of microalgae to increase biodiesel production
2021 Bertolini, Marta; Conti, Fosca
Genetic engineering of microalgae to increase biodiesel production
2021 Bertolini, Marta; Conti, Fosca
Highly reliable die-attach bonding with etched brass flakes
2021 Krishna Bhogaraju, Sri; Schmid, Maximilian; R Kotadia, Hiren; Conti, Fosca; Elger, Gordon
Hydrogen production from biomass
2023 Roncarati Giovanni, Ettore; Conti, Fosca
Low temperature and low pressure die-attach bonding of high power light emitting diodes with self reducing copper complex paste
2021 Krishna Bhogaraju, Sri; Schmid, Maximilian; Hufnagel, Elias; Conti, Fosca; R Kotadia, Hiren; Elger, Gordon
Micro-Raman to detect stress phenomena in Si-chips bonded onto Cu substrates
2021 Pascucci, Jacopo; Conti, Fosca; Krishna Bhogaraju, Sri; Signorini, Raffaella; Liu, E; Pedron, Danilo; Elger, Gordon
Phosphoric acid and its interactions with polybenzimidazole type polymers
2016 C., Korte; Conti, Fosca; J., Wackerl; W., Lehnert
Raman spectroscopy to investigate gallium nitride light emitting diodes after assembling onto copper substrates
2021 Conti, Fosca; Lux, Kerstin; Krishna Bhogaraju, Sri; Liu, E; Lenz, Christoph; Seitz, Roland; Elger, Gordon
Simulations and Experiments to Analyze Stress Phenomena in Soldered and Sintered Interconnections between Silicon Nitride chips and Copper Substrates
2021 Liu, E; Conti, Fosca; Krishna Bhogaraju, Sri; Elger, Gordon
Stress evaluations of silicon nitride chips bonded onto copper substrates via SAC soldering, AuSn soldering, and copper sintering
2020 Conti, Fosca; Liu, E; Krishna Bhogaraju, Sri; Lenz, Christoph; Seitz, Roland; Elger, Gordon